Case Studies
Real-world applications demonstrating Zander's impact across industries
Full-Automatic Optical Module AOI Inspection Equipment
Equipment Info
Compatible Products: 25G, 100G, 200G, 400G, 800G Optical Modules Production Capacity: 1200 Pcs/h Product Loading Method: Non-stop Loading
Glass Carrier Inspection Equipment
Equipment Info
Applicable Products: Glass carriers of various sizes Loading Method: Tray loading Inspection Method: Camera vision inspection system Detectable Defects: Chipped edges & corners, scratches, pits, abnormal coating color
Optical Fiber Crack Detection Equipment
Equipment Info
Compatible Products: Optical Fiber with 125μm Diameter Product Loading Method: Manual Tray Loading Product Inspection Method: Camera Vision Inspection System
BGA Product 3D-AOI Inspection Equipment
Equipment Info
Compatible Products: 800G Optical Modules Assembly Accuracy: ±0.05 mm Dispensing Volume Stability: ±5% Dispensing Accuracy: ±10%
Full-Automatic Optical Fiber Endface Inspection Equipment
Equipment Info
Compatible Products: 200G, 400G, 800G Optical Modules Product Loading Method: Manual Tray Loading
Femtosecond Laser Surface Microprocessing System
Equipment Info
Applications: Ceramic Ferrule Pins, Metal Materials Minimum Feature Size: ≤10 μm Repeatability: ±2 μm Positioning Accuracy: ±1 μm
Zero-Taper Laser Drilling System for Communication Substrates
Equipment Info
Applications: Communication Substrates, Optical Connectors Processing Technology: 5-Axis Femtosecond Laser with Beam Rotatio Drilling Accuracy: ±0.5 μm
Full-Automatic Optical Module Cover Plate Assembly & Dispensing Equipment
Equipment Info
Compatible Products: 100G, 200G, 400G, 800G Optical Modules Compatible Product Carriers: Universal & Quick-change Type Product Handling Method: 6-axis Robot Arm & Vacuum Suction
BP & PCBA Assembly Equipment
Equipment Info
Compatible Products: 400G, 800G,1.6T Optical Modules Dispensing Accuracy: Dispensing Volume ±10%; Module Repeat Positioning Accuracy ±0.01 mm Vision Accuracy: Camera Inspection Accuracy ±0.01 mm
Housing & PCBA Assembly Equipment
Equipment Info
Compatible Products: 800G Optical Modules Assembly Positioning Accuracy: ±0.05 mm Adhesive Volume Stability: ±5% Dispensing Position Accuracy: Dispensing Volume ±10%
Automatic Laser Bonding Equipment
Equipment Info
Processed Products: Chips Equipment Accuracy: Rotation Angle Accuracy: ±0.05°; Positioning Accuracy: ±10 μm; Height Tolerance: ±10 μm Temperature Measurement Calibration: Blackbody + Chip Method Temperature Measurement Stability: ±3 °C
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